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573300D00010G

Boyd Laconia LLC

Heat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...

FICHA TÉCNICA

Cumple con RoHS

REEL embalaje

Certificate of Compliance Guarantee

DESCRIPCIÓN

The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.

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ESPECIFICACIÓN

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Proveedor:

Boyd Laconia LLC

Nº de pieza:

573300D00010G

Alias/alias:

041644

Unidad de medida:

Por Each

RoHS:

Yes

HTS:

8473309000

COO:

ECCN:

EAR99

Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.