4951G
Boyd Laconia LLCAdhesive - Thermal - Epoxy - Black - 1.34 W/m.K - 9200 psi - Bag. ...
DESCRIPCIÓN
The 4951G is a 3.5oz Thermal Bond Compound, created using a two part epoxy resin system. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics while possessing a coefficient of thermal expansion that is extremely compatible with aluminum, copper and brass. Once cured, thermal bond is exceptionally resistant to environmental hazards.
Palabras clave de búsqueda: 4951G
ESPECIFICACIÓN
EN STOCK: 0
Plazo de entrega de fábrica 18 Semanas
Guías de productos
English
Chinese
Spanish
