Iniciar sesión
ES
English
中文 / 汉语
Deutsch
Español
Nederlands
SF-1206SP300M-2
Fuse Chip Slow Blow Acting 3A 32V SMD Solder Pad 1206 T/R ...
DESCRIPCIÓN
SF-1206SP300M-2 is a time-lag multilayer surface mount fuse designed for overcurrent protection in compact electronic applications. It features a rated current of 3.00 A with a typical resistance of 0.034 O and an I²t rating of 1.20 A²s, opening within 120 seconds at 200% rated current. The fuse is housed in a 3216 (EIA 1206) footprint with multilayer SMD construction, enabling automated assembly and reliable performance across an operating temperature range of -55°C to +150°C. It is UL 248-14 listed, RoHS compliant, and halogen-free, making it suitable for portable memory devices, LCD monitors, disk drives, battery management systems, LED lighting, and industrial controllers.
Palabras clave de búsqueda: SF1206SP300M2
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple SF-1206SP300M-2 con la normativa RoHS?
Sí, SF-1206SP300M-2 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de SF-1206SP300M-2?
El plazo de entrega estándar de SF-1206SP300M-2 es de aproximadamente 14 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 15.000
Puede enviar inmediatamente
Cantidad mínima de pedido: 1000
Plazo de entrega de fábrica 14 Semanas
Hoja de datos
Bourns Profile
Learn more about Bourns® Industrial Automation Solutions with Resistors, Protection Devices and Magnetics