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SF-1206SP200-2
BournsFuse Chip Slow Blow Acting 2A 63V SMD Solder Pad 1206 T/R ...
DESCRIPCIÓN
SF-1206SP200-2 is a time-lag surface mount fuse designed for overcurrent protection in compact electronic applications. This device features a 2.0 A rated current with a typical resistance of 48.5 mO and an I²t value of 0.509 A²s, providing reliable protection with minimal voltage drop. The fuse operates over a temperature range of -20°C to +105°C and is housed in a 3216 (EIA 1206) miniature footprint measuring 3.1 mm × 1.55 mm, enabling automated surface mount assembly. It meets UL 248-14 standards, is RoHS compliant, and halogen-free, making it suitable for portable memory devices, LCD monitors, disk drives, digital cameras, cell phones, rechargeable battery packs, and industrial controllers where space constraints and automated manufacturing are critical requirements.
Palabras clave de búsqueda: SF1206SP2002
ESPECIFICACIÓN
EN STOCK: 5.000
Puede enviar inmediatamente
Cantidad mínima de pedido: 1000
Plazo de entrega de fábrica 12 Semanas
FICHA TÉCNICA
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Learn more about Bourns® Industrial Automation Solutions with Resistors, Protection Devices and Magnetics