520-AG11D
TE Connectivity / Buchanan BrandConn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Tube ...
DESCRIPTION
The 520-AG11D is a standard DTP socket designed for reliable interconnection in printed circuit board applications. It features 20 positions with a 2.54 mm centerline spacing and 7.62 mm row-to-row spacing, utilizing through-hole contact termination with beryllium copper contacts plated in gold for superior conductivity and durability. The socket is constructed with a thermoplastic GF housing rated UL 94V-0, operates across a temperature range of -55°C to +125°C, and delivers a contact resistance of 10 mO with a 3A contact rating. With its screw machine contact style and four-fingered mating design, this socket is ideal for production applications requiring robust, high-reliability interconnections in industrial and commercial electronic equipment.
Product Highlights:
- DIP Socket
- Number of Positions = 20
- Row-to-Row Spacing = 7.62 mm
- Thru Hole
- Mount Style = Vertical
Search Keywords: 520AG11D
SPECIFICATIONS
IN STOCK: 1,680
Can Ship immediately
Minimum Order Quantity: 480
Multiple: 24
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