520-AG11D-LF
TE Connectivity / Buchanan BrandConn DIP Socket SKT 20 POS 2.54mm Solder ST Thru-Hole Tube ...
DESCRIPTION
520-AG11D-LF is a 20-position closed frame DIP socket from the 500 Series, designed for through-hole mounting applications. It features a vertical mount style with 7.62 mm (0.300 in) row-to-row spacing and 2.54 mm (0.100 in) centerline pitch. The socket utilizes beryllium copper contacts with gold plating (25 µin) in the mating area and tin-plated solder tails measuring 3.18 mm (0.125 in) in length. Electrical performance includes 5,000 MO insulation resistance and 10 mO contact resistance, with an operating temperature range of -55°C to +105°C. The thermoplastic polyester housing carries a UL 94V-0 flammability rating and is RoHS/ELV compliant, making it suitable for lead-free wave soldering processes up to 265°C.
Product Highlights:
- Socket Style = Standard
- Through Hole Contact Termination Type
- 2.54 mm Centerline
- Row-to-Row Spacing = 7.62 mm
- 20 Positions
Search Keywords: 520AG11DLF
SPECIFICATIONS
IN STOCK: 4,390
Can Ship immediately
Minimum Order Quantity: 24
Multiple: 24
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