625-25AB by wakefield
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625-25AB

Wakefield

Heat Sink - Top Mount - BGA - Thermal Tape, Adhesive (Included) - 0.984" (25.00mm) Square - 6.35mm Pin Fins - 12.00°C/W @ 500 LFM - Aluminum. ...

产品说明书
符合 RoHS 规定
包装
附件
Request Programming Quote
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. 合规证书保证

描述

The WAKEFIELD part 625-25AB is a high-quality heat sink designed specifically for passive BGA pin array applications. It features a durable adhesive that ensures secure attachment to the BGA pin array, while its aluminum construction provides excellent heat dissipation properties. The heat sink is finished with a sleek black anodized coating, adding a touch of elegance to any electronics application. With its reliable performance and attractive design, the WAKEFIELD 625-25AB is the perfect choice for effectively managing heat in BGA pin array setups.

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规格

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供应商:
Wakefield
部件编号:
625-25AB
别名/又称:
62525AB
计量单位:
每 Each
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1600
器件冷却方式:
BGA
安装方式:
Adhesive
尺寸:
25 x 25 x 6.4 mm
热阻:
N/A
表面处理:
Black Anodized

有存货: 1,126

发货 today, if you order in

库存数量的起订量: 5

缺货数量的起订量: 400

工厂交货期 16 周

价格 (USD)

数量
单价
5
$10.28
100
$10.25
250
$10.23
400
$10.20
800
$5.40
1,200
$3.80
1,600 +
$3.72
供应商标准包装
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