描述

The HTS768-U is a heat sink assembly designed for use with BGA (Ball Grid Array) semiconductor packages. It features a 3-fin radial design with black anodized aluminum construction, providing efficient thermal management for high-performance applications. The assembly has a diameter of 34.92 mm (1.375 in) and a height of 11.86 mm (0.467 in), with a package size of 25 mm (0.985 in), and includes a four-leg standard mounting clip that does not increase the overall heat sink height. The product is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink assembly is ideal for thermal management in compact electronic systems where space constraints and reliable heat dissipation are critical requirements.