HTS654-U
Heat Sink Passive BGA Radial Aluminum Black Anodized ...
描述
The HTS654-U is a heat sink assembly engineered for thermal management of BGA semiconductor packages. It features a 7-fin radial design constructed from aluminum with a black anodize finish, providing effective heat dissipation across a range of operating conditions. The assembly has a package size of 21 mm, a diameter of 34.92 mm, and a height of 22.70 mm, with a flammability rating of UL 94V-0. Thermal resistance varies from 10.56°C/W at 0 LFM to 2.06°C/W at 600 LFM depending on power dissipation levels (5W to 15W), making it suitable for applications requiring efficient passive cooling in compact form factors. The integrated two-leg mounting clip simplifies installation without increasing overall heat sink height, and the product is RoHS and ELV compliant.
搜索关键词: HTS654U
规格
常见问题
HTS654-U 是否已停产?
是的,Te Connectivity / Chip Coolers Brand 的 HTS654-U 已停产(生命周期结束时间:一月 2022)。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
HTS654-U 是否符合 RoHS 标准?
是的,HTS654-U 符合 RoHS 标准。
HTS654-U 的交货期是多少?
HTS654-U 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。
有存货: 130
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最小订购数量: 3
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