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HTS285NF-D
Heat Sink Passive BGA Pin Array Cold-Forged Aluminum Black Anodized ...
描述
HTS285NF-D is a BGA heat sink assembly designed for thermal management of BGA semiconductor packages. The unit features a cold-forged aluminum construction with a 50.80 mm diameter and 19.05 mm height, providing efficient heat dissipation in compact form factors. It includes a four-leg standard mounting clip (Part Number 1542026-1) that does not increase the overall heat sink height, enabling seamless integration into space-constrained applications. The assembly is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink is ideal for high-performance computing, telecommunications, and industrial applications where reliable thermal management of BGA packages is critical.
搜索关键词: HTS285NFD
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常见问题
HTS285NF-D 是否已停产？
是的，Te Connectivity / Chip Coolers Brand 的 HTS285NF-D 已停产。Master Electronics 是授权分销商，可能仍有剩余库存或可提供推荐的替代产品。
HTS285NF-D 是否符合 RoHS 标准？
是的，HTS285NF-D 符合 RoHS 标准。
HTS285NF-D 的交货期是多少？
HTS285NF-D 的标准交货期约为 10 周。有库存的数量由 Master Electronics 发货。
有存货: 40
发货 today, 输入设置值。
最小订购数量: 4
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