描述

The HTS264NF-D is a 27mm passive heat sink assembly designed for thermal management of BGA semiconductor packages. It features a single pin-fin design constructed from cold-forged aluminum with black anodized plating, providing efficient heat dissipation without active cooling. The heat sink measures 34.95 mm in diameter and 12.7 mm in height, with thermal resistance values ranging from 3.36°C/W to 12.44°C/W depending on air velocity conditions (0 to 600 LFM). It includes a four-leg standard clip mounting system that does not increase the overall height, enabling easy installation on BGA devices. This passive solution is ideal for applications requiring reliable thermal management in compact form factors, with compliance to UL 94V-0 flammability standards and EU RoHS/ELV regulations.