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HTS248-U by te connectivity / chip coolers brand
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HTS248-U

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

符合 RoHS 规定
Box 包装
附件
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Discontinued
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描述

HTS248-U is a heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a diameter of 34.92 mm (1.375 in) and a height of 13.87 mm (0.546 in), supporting power dissipation ratings of 5W, 10W, and 15W. Thermal resistance values range from 2.9°C/W to 10.98°C/W depending on operating conditions. This heat sink is EU RoHS and ELV compliant with exemptions and carries a UL 94V-0 flammability rating, making it suitable for applications requiring reliable thermal solutions for BGA devices.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 35 [1.379] mm [in]
  • For Use With BGA Semiconductor Packages
  • Power Air Velocity Thermal Resistance

Search Keywords: HTS248U

规格

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Products found: 0
供应商:
TE Connectivity / Chip Coolers Brand
部件编号:
HTS248-U
Alias/AKA:
9-1542000-4
计量单位:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Box
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
13.87 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

有存货: 500

可立即发货

Minimum Order Quantity: 3

PRICE (USD)

数量
Unit Price
3
$22.26
15
$21.85
30
$21.43
59
$21.02
250
$20.60
500 +
$14.42

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