HTS248-U
Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
描述
HTS248-U is a heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a diameter of 34.92 mm (1.375 in) and a height of 13.87 mm (0.546 in), supporting power dissipation ratings of 5W, 10W, and 15W. Thermal resistance values range from 2.9°C/W to 10.98°C/W depending on operating conditions. This heat sink is EU RoHS and ELV compliant with exemptions and carries a UL 94V-0 flammability rating, making it suitable for applications requiring reliable thermal solutions for BGA devices.
产品亮点:
- Heat Sink
- BGA
- Package Size = 35 [1.379] mm [in]
- For Use With BGA Semiconductor Packages
- Power Air Velocity Thermal Resistance
搜索关键词: HTS248U
规格
常见问题
HTS248-U 是否已停产?
是的,Te Connectivity / Chip Coolers Brand 的 HTS248-U 已停产(生命周期结束时间:一月 2022)。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
HTS248-U 是否符合 RoHS 标准?
是的,HTS248-U 符合 RoHS 标准。
HTS248-U 的交货期是多少?
HTS248-U 的标准交货期约为 2 周。有库存的数量由 Master Electronics 发货。
有存货: 250
可立即发货
最小订购数量: 3
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