HTS191-P
Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
描述
HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.
产品亮点:
- Heat Sink
- BGA
- Package Size = 25 [.985] mm [in]
- For Use With BGA Semiconductor Packages
- Diameter = 25.00 mm
搜索关键词: HTS191P
规格
常见问题
HTS191-P 是否已停产?
是的,Te Connectivity / Chip Coolers Brand 的 HTS191-P 已停产(生命周期结束时间:一月 2022)。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
HTS191-P 是否符合 RoHS 标准?
是的,HTS191-P 符合 RoHS 标准。
HTS191-P 的交货期是多少?
HTS191-P 的标准交货期约为 8 周。有库存的数量由 Master Electronics 发货。
有存货: 232
可立即发货
最小订购数量: 6
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