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HTS186-U by te connectivity / chip coolers brand
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HTS186-U

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

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符合 RoHS
Box 包装
附件
请求编程报价
已停产
合规证书

描述

HTS186-U is a 21mm heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a height of 13.97 mm, diameter of 25.4 mm, and supports power ratings of 5W, 10W, and 15W depending on airflow conditions. The assembly includes a two-leg mounting clip (Part Number 1542431-1) that does not increase overall heat sink height. This EU RoHS and ELV compliant component is ideal for cooling BGA devices in applications requiring efficient thermal solutions with UL 94V-0 flammability rating.

搜索关键词: HTS186U

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
TE Connectivity / Chip Coolers Brand
部件编号:
HTS186-U
别名/又称:
2-1542006-3
计量单位:
每 Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
1
封装类型:
Box
生命周期:
已停产

常见问题

HTS186-U 是否已停产?

是的,Te Connectivity / Chip Coolers Brand 的 HTS186-U 已停产。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。

HTS186-U 是否符合 RoHS 标准?

是的,HTS186-U 符合 RoHS 标准。

HTS186-U 的交货期是多少?

HTS186-U 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。

  此产品已停产,但仍有库存

有存货: 887

可立即发货

最小订购数量: 10

价格 (USD)

数量
单价
10
$10.88
35
$10.68
65
$10.46
150
$10.28
450
$10.07
500 +
$7.05

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