HTS186-U
Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
描述
HTS186-U is a 21mm heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a height of 13.97 mm, diameter of 25.4 mm, and supports power ratings of 5W, 10W, and 15W depending on airflow conditions. The assembly includes a two-leg mounting clip (Part Number 1542431-1) that does not increase overall heat sink height. This EU RoHS and ELV compliant component is ideal for cooling BGA devices in applications requiring efficient thermal solutions with UL 94V-0 flammability rating.
搜索关键词: HTS186U
规格
常见问题
HTS186-U 是否已停产?
是的,Te Connectivity / Chip Coolers Brand 的 HTS186-U 已停产。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
HTS186-U 是否符合 RoHS 标准?
是的,HTS186-U 符合 RoHS 标准。
HTS186-U 的交货期是多少?
HTS186-U 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。
有存货: 887
可立即发货
最小订购数量: 10
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