描述

The 808-AG12D-LF is an 8-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features beryllium copper screw machine contacts with tin plating and a four-fingered mating design, providing reliable electrical connection for dual inline package (DIP) integrated circuits. The socket has a row-to-row spacing of 7.62 mm (0.300 in), centerline spacing of 2.54 mm (0.100 in), and a height above the PCB of 2.67 mm (0.105 in), with solder tail posts of 3.18 mm (0.125 in) length. Electrical performance includes an insulation resistance of 5,000 MO and contact resistance of 10 mO, with the socket rated for temperatures up to 105°C and compatible with wave solder processes up to 265°C. This socket is ideal for applications requiring secure IC insertion and removal, such as development boards, test fixtures, and consumer electronics where DIP components need to be socketed for easy replacement or upgrades.