注册
CN
English
中文 / 汉语
Deutsch
Español
Nederlands
描述
5533268-5 is a high-density board-to-board connector from TE Connectivity's AMP-HDI series, designed for reliable electrical and mechanical performance in rugged applications. The AMP-HDI connector family features Twin Beam Contacts (TBC) with gold plated square posts providing four areas of contact per connection. The connectors are rated for a current of 3A maximum with contact resistance of 15 mO and operate over a temperature range of -65°C to 125°C. The housing is constructed from glass-filled thermoplastic rated UL94 V-0, and the connectors are compatible with vapor phase and infrared reflow soldering. Common applications include aerospace data processing, military electronics, industrial instrumentation, and data communication systems.
搜索关键词: 55332685
规格
常见问题
5533268-5 是否符合 RoHS 标准？
是的，5533268-5 符合 RoHS 标准。
5533268-5 的交货期是多少？
5533268-5 的标准交货期约为 45 周。有库存的数量由 Master Electronics 发货。
有存货: 956
可立即发货
库存数量的起订量: 4
缺货数量的起订量: 4
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 4
工厂交货期 45 周
3D PDF
Product Drawing - ASSEMBLY, RECEPTACLE, RIGHT ANGLE, HDI, LEAD-FREE, 3 ROW, WITHOUT GUIDES, 3.05[.120] SOLDER TAILS
数据表
Product Specification - Connector, Interconnect, High Density
Instruction Sheet - AMP-HDI High Density Interconnection Printed Circuit (PC) Board Connectors