描述

5223000-2 is a Z-PACK 2mm Futurebus+ board-to-board header connector designed for high-density signal transmission in PCB applications. The connector features 60 signal positions arranged in 5 rows with a 2mm centerline pitch, utilizing a vertical solder post termination method with a post length of 4.25mm. The contact mating area is gold-plated for reliable electrical connection, while the solder tail contacts are tin-plated, and the housing is constructed from liquid crystal polymer (LCP) material. With a maximum contact current rating of 3A, dielectric withstanding voltage of 1000VAC, and operating temperature range of -55°C to +125°C, this connector is well-suited for industrial and telecommunications applications requiring robust board-to-board interconnection. The connector is EU RoHS and ELV compliant, ensuring environmental and regulatory compliance for modern electronic systems.