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描述
The 399-HT-114 is an AMP AUGAT HOLTITE solderless spring socket designed to form a zero-profile interconnect within a plated-through hole on a printed circuit board. Constructed from beryllium-copper with either gold or tin/lead plating, this socket is press-fit into the board, eliminating the need for soldering. The socket is designed for use in glass epoxy (FR-4, G-10) PC boards and is applied either manually or with automated machinery. This system creates a reliable, low-profile connection for a broad range of electronic parts and components. The solderless design provides a key advantage by allowing for easy component repair and replacement.
产品亮点:
- Hand Tool
- Production Application
搜索关键词: 514375147
规格
有存货: 2
可立即发货
制造商库存: 32 可以发货 8/24/26
工厂交货期 13 周 可以发货 11/9/26
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