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描述
5-103639-4 is a wire-to-board receptacle housing assembly designed for the AMPMODU interconnection system with 0.100 inch [2.54 mm] centerline spacing. This product supports multiple position configurations ranging from 1 to 25 positions, with dimensions varying according to position count. The assembly accommodates wire sizes from 30-26 AWG [0.05-0.15 mm²] and 26-22 AWG [0.12-0.3 mm²], with multiple contact plating options including Plating A, B, and C variants. The housing is available in both strip form and individual form configurations, with unloaded housing options for custom assembly. This interconnection system is widely used in industrial control, telecommunications, and consumer electronics applications where reliable wire-to-board connections are required.
产品亮点:
- Header
- Number of Positions = 5
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 51036394
规格
常见问题
5-103639-4 是否符合 RoHS 标准？
是的，5-103639-4 符合 RoHS 标准。
5-103639-4 的交货期是多少？
5-103639-4 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 3,056
可立即发货
最小订购数量: 35
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 35
工厂交货期 17 周
3D PDF
Product Drawing - HDR ASY,VERT,SNGL ROW 2.54.100 C/L 0.64.025 SQ PST, WTH PLZN<CHNG,AMPMODU MTE
数据表
Product Specification - AMPMODU MTE Interconnection System
