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描述
3-87456-9 is a double-row plain housing designed for the AMPMODU Mod IV wire-to-board interconnection system. This unstamped housing features 50 positions with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and is manufactured from glass-filled thermoplastic rated 94V-0. The housing accepts receptacle contacts that terminate 32-20 AWG discrete wire and mates with .025 inch square or round posts. With a contact current rating of 3 amperes and dual cantilever contact beam design with anti-overstress feature, this housing is suitable for reliable wire-to-board connections in various electronic applications.
产品亮点:
- Housing
- Not Preloaded
- Number of Positions = 50
- Housing Type = Receptacle
- Number of Rows = Dual
搜索关键词: 3874569
规格
常见问题
3-87456-9 是否符合 RoHS 标准？
是的，3-87456-9 符合 RoHS 标准。
3-87456-9 的交货期是多少？
3-87456-9 的标准交货期约为 26 周。有库存的数量由 Master Electronics 发货。
有存货: 1,673
发货 today, 输入设置值。
最小订购数量: 5
工厂交货期 26 周
价格 (USD)
3D PDF
数据表
Product Specification - AMPMODU Mod 1/2 Wire to Board Standard Pressure Contact Interconnection System
