描述
The 2338495-3 is a 1x4 OSFP cage assembly with open back configuration designed to support next-generation data center connectivity. It features an 8-lane high-density connector with 0.6 mm pitch and 60 contacts total, following the OSFP MSA specification, with a simple low-cost wafer design utilizing 2 rows of contacts. The open back design allows airflow through the module shell to cool downstream electronics in front-to-back airflow systems or exhaust for back-to-front airflow, while the belly-to-belly capable design via in-ground alignment reduces PCB cost and noise. Proven to support 56G PAM-4 protocols with a roadmap to 112G PAM-4, this cage assembly supports aggregate data rates up to 800 Gbps and thermal loads up to 15W with low airflow, making it ideal for high-port-density switch form factors that can accommodate up to 32 ports in a 1RU configuration.
搜索关键词: 23384953
规格
常见问题
2338495-3 是否符合 RoHS 标准?
是的,2338495-3 符合 RoHS 标准。
2338495-3 的交货期是多少?
2338495-3 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。
有存货: 36
可立即发货
库存数量的起订量: 3
缺货数量的起订量: 3
工厂交货期 9 周
English
中文 / 汉语
Deutsch
Español
Nederlands
