描述

The 2-1542002-2 is a 25mm heatsink assembly designed for thermal management of BGA packages. It comprises a two-fin aluminum heatsink with black anodize finish, a black PEI mounting clip (UL94-VO rated), and an interface component. The heatsink features a 1.375 inch diameter with 0.332 inch height, and the mounting clip is sized for 25mm applications with a 5/8-27 UNS-2A thread specification. The assembly supports torque specifications of 1.5 inch-lb (8.5 lbs force for bare die, 8.3 lbs force for full size lid package) and 2.0 inch-lb (11.4 lbs force for bare die, 11.1 lbs force for full size lid package). This heatsink assembly is RoHS compliant and certified, making it suitable for high-reliability thermal solutions in electronic packaging applications.