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2101041-3 by te connectivity / amp brand

2101041-3

TE Connectivity / AMP Brand

EMI spring with no-snag design and peel-and-stick adhesive backing for electromagnetic interference shielding applications. ...

产品说明书
符合 RoHS 规定
包装
附件
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描述

The 2101041-3 is an A600 EMI spring designed with a no-snag feature and peel-and-stick adhesive backing for easy installation in electromagnetic shielding applications. This component is engineered to provide effective EMI suppression while minimizing snagging during assembly and deployment. The product is wave solder capable to 265°C, enabling integration into standard manufacturing processes. It is compliant with EU RoHS Directive 2011/65/EU and does not contain REACH SVHC substances, meeting stringent environmental and regulatory requirements. The peel-and-stick design simplifies installation in confined spaces and reduces assembly time, making it ideal for consumer electronics, telecommunications equipment, and industrial devices requiring reliable EMI containment.

Search Keywords: 21010413

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供应商:
TE Connectivity / AMP Brand
部件编号:
2101041-3
计量单位:
Per Each
RoHS:
Yes
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
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有存货: 108

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Minimum Order Quantity: 9

工厂交货期 9 周

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