描述

The 1825374-4 is a 16-position DIP socket designed for vertical thru-hole mounting of integrated circuits. It features a DIPLOMATE DL (Dual Leaf) contact design with phosphor bronze contacts plated in gold (15 µm) for reliable mating and low contact resistance of 30 mO. The socket has a row-to-row spacing of 7.87 mm (0.310 in), a centerline of 2.54 mm (0.100 in), and a height above the PCB of 5.33 mm (0.210 in), with solder tail posts of 3.05 mm (0.120 in) length. The housing is constructed from thermoplastic glass-reinforced material with UL 94V-0 flammability rating, and the socket is RoHS and ELV compliant with an operating temperature range up to 125°C. This socket is ideal for production applications requiring reliable IC insertion and removal, with wave solder capability up to 265°C.