描述

The 1825093-4 is a 16-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features a DIPLOMATE DL (Dual Leaf) contact design with phosphor bronze contacts plated in gold for reliable mating with DIP packages. The socket has a row-to-row spacing of 7.62 mm, a centerline spacing of 2.54 mm, and a height above the PCB of 5.33 mm, with solder tails of 3.25 mm length plated in tin. Electrical performance includes an insulation resistance of 10,000 MO and contact resistance of 30 mO, with the housing constructed from thermoplastic glass-reinforced material rated UL 94V-0. The socket is RoHS and ELV compliant, wave solder capable to 265°C, and recommended for automatic insertion processes, making it suitable for high-volume production applications requiring reliable DIP package interconnection.