描述

1-103167-0 is a standard profile shrouded header component from the AMPMODU Interconnection System designed for board-to-board connections with breakaway and retention capabilities. The product features a 0.050 inch (1.27 mm) centerline spacing and is available in multiple position configurations ranging from 8 to 72 positions, with corresponding dimensional variations. Key technical characteristics include multiple plating options (Plating A, B, and C variants) for different application requirements, with dimensions specified in both inches and millimeters for precise PCB layout compatibility. The header design provides design and inventory versatility by allowing breakaway into any required size, making it suitable for embedded systems, industrial control applications, and modular electronic assemblies where flexible interconnection solutions are needed.