描述
The 103908-7 is a swaged tall vertical through-hole (THT) header designed for the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and conductivity. This header supports wire-to-board and wire-to-wire interconnection applications with insulation displacement contacts (IDC) or crimp snap-in contacts, accommodating 2 to 25 positions per row with 100 mil centerline spacing. The product operates over a temperature range of -65°C to +105°C and supports current ratings of 3 amps per contact in free air at 267 V operating voltage. The swaged post design provides superior retention in printed circuit boards, making it ideal for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable, polarized, and latching connections are required.
产品亮点:
- Header
- Number of Positions = 8
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 1039087
规格
常见问题
103908-7 是否符合 RoHS 标准?
不,103908-7 不符合 RoHS 标准。
103908-7 的交货期是多少?
103908-7 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 2,345
可立即发货
库存数量的起订量: 115
缺货数量的起订量: 115
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 23
工厂交货期 17 周
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