描述
The 103735-8 is a vertical through-hole (THT) header connector with standard configuration and 30 µ" gold plating, designed for wire-to-board applications within the TE Connectivity AMPMODU MTE interconnect system. This connector supports 2–25 positions per row with Insulation Displacement Contacts (IDC) or crimp snap-in contact options, accommodating wire gauges from #22–#30 AWG for IDC and #20–#32 AWG for crimp configurations. The connector operates at a maximum current rating of 3 amps per single contact in free air and 267 V operating voltage, with an operating temperature range of -65°C to +105°C. It features latching and polarization assembly designs, swage options on posts for PC board retention, and is compatible with coupling shrouds for ganging multiple assemblies. Common applications include computers, medical equipment, automotive controls, commercial printers, appliances, and telecommunications equipment.
产品亮点:
- Header
- Number of Positions = 9
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 1037358
规格
常见问题
103735-8 是否符合 RoHS 标准?
不,103735-8 不符合 RoHS 标准。
103735-8 的交货期是多少?
103735-8 的标准交货期约为 15 天。有库存的数量由 Master Electronics 发货。
有存货: 185
可立即发货
您可以购买所有有库存数量的 185
仅库存批次: 185
库存数量的起订量: 399
缺货数量的起订量: 399
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 21
工厂交货期 15 周
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