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描述
103735-1 is a single-row vertical through-hole (THT) header from the AMPMODU MTE interconnect system, designed for wire-to-board applications. This standard header features 30 µ" gold plating and supports 2-25 positions per row, with a current rating of 3 amps maximum per single contact in free air. The connector operates over a temperature range of -65°C to +105°C and is compatible with IDC and crimp snap-in receptacle assemblies. Common applications include medical instruments, automotive controls, computers, commercial printers, appliances, and telecommunications equipment where reliable board-level connections are required.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 2
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 1037351
规格
常见问题
103735-1 是否符合 RoHS 标准？
不，103735-1 不符合 RoHS 标准。
103735-1 的交货期是多少？
103735-1 的标准交货期约为 15 周。有库存的数量由 Master Electronics 发货。
有存货: 9,421
可立即发货
最小订购数量: 216
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 72
工厂交货期 15 周
3D PDF
Product Drawing - HDR ASSY, VERT, SR 2.54[.100] C, 0.64[.025] SQ POST, WITH PLZN AND LATCHING,
数据表
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
