描述
103669-9 is a swaged tall vertical through-hole (THT) header with matte tin plating, part of the AMPMODU MTE interconnect system from TE Connectivity. This header is designed for wire-to-board connectivity applications and features polarization and latching capabilities to ensure secure mating. The product supports 2 to 25 positions per row with 100 mil centerline spacing, accommodates wire gauges from #22 to #30 AWG for IDC configurations, and operates reliably across a temperature range of -65°C to +105°C. With a current rating of 3 amps per single contact in free air and an operating voltage of 267 V, this header is well-suited for industrial applications including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where cost-effective, reliable interconnection is required.
产品亮点:
- Header
- Number of Positions = 10
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 1036699
规格
FREQUENTLY ASKED QUESTIONS
Is 103669-9 RoHS compliant?
No, 103669-9 is not RoHS compliant.
What is the lead time for 103669-9?
The standard lead time for 103669-9 is approximately 27 days. In-stock quantities ship from Master Electronics.
有存货: 1,114
发货 today, 输入设置值。
库存数量的起订量: 152
缺货数量的起订量: 152
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 19
工厂交货期 27 周
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