642-25AB
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized ...
描述
The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.
搜索关键词: 64225AB
规格
常见问题
什么产品可以替代 642-25AB?
642-25AB 的推荐替代产品是 Wakefield 的 641K,可从 Master Electronics 购买。
642-25AB 是否符合 RoHS 标准?
是的,642-25AB 符合 RoHS 标准。
642-25AB 的交货期是多少?
642-25AB 的标准交货期约为 16 周。有库存的数量由 Master Electronics 发货。
English
中文 / 汉语
Deutsch
Español
Nederlands
