help desk software
625-25AB by wakefield
Image is representational - see mfr. specs

625-25AB

Wakefield

Heat Sink - Top Mount - BGA - Thermal Tape, Adhesive (Included) - 0.984" (25.00mm) Square - 6.35mm Pin Fins - 12.00°C/W @ 500 LFM - Aluminum. ...

产品说明书
符合 RoHS 规定
包装
附件
Request Programming Quote
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

描述

The WAKEFIELD part 625-25AB is a high-quality heat sink designed specifically for passive BGA pin array applications. It features a durable adhesive that ensures secure attachment to the BGA pin array, while its aluminum construction provides excellent heat dissipation properties. The heat sink is finished with a sleek black anodized coating, adding a touch of elegance to any electronics application. With its reliable performance and attractive design, the WAKEFIELD 625-25AB is the perfect choice for effectively managing heat in BGA pin array setups.

Search Keywords: 62525AB

规格

Product Attribute
Attribute Value
Select Attribute
Products found: 0
供应商:
Wakefield
部件编号:
625-25AB
Alias/AKA:
62525AB
计量单位:
Per Each
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1600
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
25 x 25 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized

有存货: 1,126

可立即发货

库存数量的起订量: 5

缺货数量的起订量: 400

工厂交货期 16 周

数量
Unit Price
5
$5.48
100
$4.51
250
$4.20
400
$4.19
800
$4.18
1,200
$4.17
1,600 +
$4.16
Suppliers Standard Package
Log in for special pricing Click for Quote Price Match Request
Please Note: Tariffs may apply for U.S. shipments

Tools/3D Models

产品指南