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624-25ABT3
The 624-25ABT3 is an omnidirectional aluminum pin fin heat sink with a pre-applied thermal adhesive, designed for cooling 21mm BGA packages. ...
描述
The 624-25ABT3 is an omnidirectional pin fin heat sink designed for thermal management of 21mm BGA packages in both natural and forced-convection environments. It is constructed from black anodized aluminum with base dimensions of 0.827 inches square and a fin height of 0.250 inches. This part includes a pre-applied Chomerics T412 (-T3) pressure-sensitive adhesive, which provides a thermal impedance of 0.25 C-in^2/W and is ideal for metal or ceramic surfaces. The integrated adhesive allows for quick and easy mounting, providing a reliable thermal link to the electronic package.
搜索关键词: 62425ABT3
规格
常见问题
624-25ABT3 是否符合 RoHS 标准？
是的，624-25ABT3 符合 RoHS 标准。
624-25ABT3 的交货期是多少？
624-25ABT3 的标准交货期约为 16 周。有库存的数量由 Master Electronics 发货。
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