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HTS654-U by te connectivity / chip coolers brand
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HTS654-U

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Aluminum Black Anodized ...

产品说明书
符合 RoHS 规定
Tray 包装
附件
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Discontinued
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描述

The HTS654-U is a heat sink assembly engineered for thermal management of BGA semiconductor packages. It features a 7-fin radial design constructed from aluminum with a black anodize finish, providing effective heat dissipation across a range of operating conditions. The assembly has a package size of 21 mm, a diameter of 34.92 mm, and a height of 22.70 mm, with a flammability rating of UL 94V-0. Thermal resistance varies from 10.56°C/W at 0 LFM to 2.06°C/W at 600 LFM depending on power dissipation levels (5W to 15W), making it suitable for applications requiring efficient passive cooling in compact form factors. The integrated two-leg mounting clip simplifies installation without increasing overall heat sink height, and the product is RoHS and ELV compliant.

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规格

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Products found: 0
供应商:
TE Connectivity / Chip Coolers Brand
部件编号:
HTS654-U
计量单位:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
22.7 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

有存货: 130

可立即发货

Minimum Order Quantity: 3

PRICE (USD)

数量
Unit Price
3
$21.86
15
$21.46
30
$21.06
60
$20.64
450
$20.25
500 +
$14.17
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