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HTS191-P by te connectivity / chip coolers brand
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HTS191-P

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

产品说明书
符合 RoHS 规定
Tray 包装
附件
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Discontinued
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描述

HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 25 [.985] mm [in]
  • For Use With BGA Semiconductor Packages
  • Diameter = 25.00 mm

Search Keywords: HTS191P

规格

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Products found: 0
供应商:
TE Connectivity / Chip Coolers Brand
部件编号:
HTS191-P
Alias/AKA:
5-1542000-6
计量单位:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

有存货: 464

可立即发货

Minimum Order Quantity: 6

PRICE (USD)

数量
Unit Price
6
$18.58
27
$17.70
110
$16.89
270
$16.16
790 +
$15.48
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