描述
6-103639-5 is a wire-to-board receptacle assembly from the AMPMODU MTE interconnection system, designed for reliable signal and power connections. This component features a 0.100 inch (2.54 mm) centerline spacing and is compatible with wire sizes ranging from 22-30 AWG (0.05-0.3 mm²). The system offers multiple contact plating options including gold (0.000015 to 0.000050 inch) and tin for various application requirements. These receptacle assemblies are commonly used in wire-to-board interconnection applications where secure, repeatable connections are required in electronic equipment and instrumentation.
产品亮点:
- Header
- Number of Positions = 16
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 61036395
规格
常见问题
6-103639-5 是否符合 RoHS 标准?
是的,6-103639-5 符合 RoHS 标准。
6-103639-5 的交货期是多少?
6-103639-5 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 3,190
可立即发货
库存数量的起订量: 60
缺货数量的起订量: 60
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 12
工厂交货期 17 周
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