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3-87456-9 by te connectivity / amp brand
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3-87456-9

TE Connectivity / AMP Brand

50 MODIV HSG COMP DR .100CL ...

产品说明书
符合 RoHS 规定
Pack 包装
附件
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描述

3-87456-9 is a double-row plain housing designed for the AMPMODU Mod IV wire-to-board interconnection system. This unstamped housing features 50 positions with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and is manufactured from glass-filled thermoplastic rated 94V-0. The housing accepts receptacle contacts that terminate 32-20 AWG discrete wire and mates with .025 inch square or round posts. With a contact current rating of 3 amperes and dual cantilever contact beam design with anti-overstress feature, this housing is suitable for reliable wire-to-board connections in various electronic applications.

Product Highlights:

  • Housing
  • Not Preloaded
  • Number of Positions = 50
  • Housing Type = Receptacle
  • Number of Rows = Dual

Search Keywords: 3874569

规格

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Products found: 0
供应商:
TE Connectivity / AMP Brand
部件编号:
3-87456-9
计量单位:
Per Each
RoHS:
Yes
HTS:
8538906000
COO:
MX
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Pack
Mounting:
Cable Mount
Body Orientation:
Straight
Gender:
RCP
Number of Contacts:
50
Maximum Voltage Rating:
250 VAC
Maximum Current Rating:
3/Contact A
Operating Temperature:
-65 to 105 °C

有存货: 1,698

可立即发货

Minimum Order Quantity: 5

工厂交货期 26 周

PRICE (USD)

数量
Unit Price
5
$4.05
50
$3.63
100
$3.54
250
$3.49
500
$3.40
1,000
$3.35
2,500
$3.31
5,000 +
$2.75
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