描述
The 2-1542006-3 is an active heat sink assembly designed for BGA semiconductor packages, featuring a radial fin configuration with four fins and a 21mm diameter aluminum body. The heat sink is constructed from aluminum with black anodized plating and includes a two-leg clip mounting system that does not increase the overall height. It offers thermal resistance values ranging from 2.81°C/W to 12.34°C/W depending on air velocity conditions (0 to 600 LFM), with rated power dissipation capabilities of 5W, 10W, and 15W. The assembly meets UL 94V-0 flammability rating and is EU RoHS and ELV compliant, making it suitable for thermal management in high-performance semiconductor applications requiring reliable heat dissipation.
搜索关键词: 215420063
规格
常见问题
2-1542006-3 是否已停产?
是的,Te Connectivity / Amp Brand 的 2-1542006-3 已停产。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
2-1542006-3 是否符合 RoHS 标准?
是的,2-1542006-3 符合 RoHS 标准。
2-1542006-3 的交货期是多少?
2-1542006-3 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。
有存货: 887
发货 today, 输入设置值。
最小订购数量: 10
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