2101041-3
EMI spring with no-snag design and peel-and-stick adhesive backing for electromagnetic interference shielding applications. ...
描述
The 2101041-3 is an A600 EMI spring designed with a no-snag feature and peel-and-stick adhesive backing for easy installation in electromagnetic shielding applications. This component is engineered to provide effective EMI suppression while minimizing snagging during assembly and deployment. The product is wave solder capable to 265°C, enabling integration into standard manufacturing processes. It is compliant with EU RoHS Directive 2011/65/EU and does not contain REACH SVHC substances, meeting stringent environmental and regulatory requirements. The peel-and-stick design simplifies installation in confined spaces and reduces assembly time, making it ideal for consumer electronics, telecommunications equipment, and industrial devices requiring reliable EMI containment.
搜索关键词: 21010413
规格
常见问题
2101041-3 是否符合 RoHS 标准?
是的,2101041-3 符合 RoHS 标准。
2101041-3 的交货期是多少?
2101041-3 的标准交货期约为 9 天。有库存的数量由 Master Electronics 发货。
此物品目前没有价格。单击下方请求定价。您将在 24-48 小时内通过电子邮件收到报价。
请求定价 �
有存货: 108
可立即发货
最小订购数量: 9
工厂交货期 9 周
English
中文 / 汉语
Deutsch
Español
Nederlands
