描述

2013883-4 is a back plate assembly designed for LGA115X socket compatibility, providing essential structural support and mounting interface for processor-based systems. This assembly is engineered to facilitate proper thermal dissipation and mechanical stability during processor installation and operation. The component is manufactured to comply with EU RoHS Directive 2011/65/EU, EU ELV Directive 2000/53/EC, and China RoHS 2 requirements, ensuring environmental and regulatory compliance. The assembly features low halogen content (Br, Cl, F < 900 ppm per homogenous material) and is BFR/CFR/PVC free, meeting stringent material standards. This back plate assembly is commonly used in server, workstation, and high-performance computing applications where reliable socket support and thermal management are critical for system performance and longevity.