描述
1981467-1 is a server back plate designed for use with TE Connectivity's LGA 1366 processor socket systems. This robust bolster plate helps eliminate PCB bowing during compression when used with the integrated lever mechanism (ILM) that generates Z-axis compression load. The back plate is specifically designed for server applications and must be ordered separately or as part of ILM/Back Plate kits. It is compatible with Intel's Core™ i7 LGA 1366 processor socket assemblies and is validated to Intel Design Guides, ensuring reliable performance in high-end server computing environments.
产品亮点:
- Accessory
- Socket Type = LGA 1366
- Accessory Type = Backplate
- Backplate Application = Server
- Backplate Material = Steel
搜索关键词: 19814671
规格
常见问题
1981467-1 是否已停产?
是的,Te Connectivity / Amp Brand 的 1981467-1 已停产(生命周期结束时间:十二月 2019)。Master Electronics 是授权分销商,可能仍有剩余库存或可提供推荐的替代产品。
1981467-1 是否符合 RoHS 标准?
是的,1981467-1 符合 RoHS 标准。
1981467-1 的交货期是多少?
1981467-1 的标准交货期约为 10 周。有库存的数量由 Master Electronics 发货。
有存货: 610
可立即发货
最小订购数量: 3
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