描述

1-1825094-3 is a standard DIP socket assembly designed for vertical mounting on printed circuit boards with through-hole termination. It features 14 positions with a 2.54 mm centerline spacing and 7.87 mm row-to-row spacing, utilizing dual-leaf beryllium copper contacts with gold plating (30 µm) on the mating area for reliable electrical connection. The socket has a height of 5.33 mm above the PCB, a termination post length of 3.25 mm with tin-plated solder tails, and is housed in a thermoplastic GF material rated UL 94V-0. With an insulation resistance of 10,000 MO and contact resistance of 30 mO, this socket is suitable for production applications requiring wave solder capability up to 265°C and operates reliably at temperatures up to 125°C, making it ideal for standard IC package insertion in automated assembly environments.