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描述
The 1-103908-5 is a swaged tall vertical through-hole IDC header with 30 µ" gold plating, part of the TE Connectivity AMPMODU MTE interconnect system. This header is designed for wire-to-board and wire-to-wire applications in industrial equipment including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls. The product supports 2–25 positions per row with a 100 mil centerline spacing, accommodates #22–#30 AWG wire sizes, and features polarization and latching capabilities. It operates at 3 amps per single contact in free air with a maximum operating voltage of 267 V and temperature range of -65°C to +105°C. The swage option on posts provides enhanced retention in printed circuit boards, making it ideal for medium-volume applications requiring reliable, flexible interconnection solutions.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 16
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 11039085
规格
常见问题
1-103908-5 是否符合 RoHS 标准？
不，1-103908-5 不符合 RoHS 标准。
1-103908-5 的交货期是多少？
1-103908-5 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 552
可立即发货
库存数量的起订量: 60
缺货数量的起订量: 60
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 12
工厂交货期 17 周
3D PDF
Product Drawing - HDR ASSY, AMPMODU MTE, VERTICAL, SINGLE ROW, .100 CL, .025 SQ POSTS WITH LATCH
数据表
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
