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描述
The 1-103735-3 is a vertical through-hole (THT) header connector with standard configuration and 30 µ" gold plating, designed for single-row wire-to-board applications in the AMPMODU MTE interconnect system. This connector supports 2 to 25 positions with 100 mil centerline spacing and accommodates wire gauges from #22 to #30 AWG for IDC configurations. It operates at a current rating of 3 amps per single contact in free air and 267 V operating voltage, with an operating temperature range of -65°C to +105°C. The connector features latching and polarization capabilities through coupling shrouds, making it suitable for industrial applications including computers, copiers, medical equipment, and automotive controls where reliable wire-to-board connectivity is essential.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 14
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 11037353
规格
常见问题
1-103735-3 是否符合 RoHS 标准？
不，1-103735-3 不符合 RoHS 标准。
1-103735-3 的交货期是多少？
1-103735-3 的标准交货期约为 15 天。有库存的数量由 Master Electronics 发货。
有存货: 238
可立即发货
库存数量的起订量: 28
缺货数量的起订量: 28
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 14
工厂交货期 15 周
3D PDF
Product Drawing - HDR ASSY, VERT, SR 2.54[.100] C, 0.64[.025] SQ POST, WITH PLZN AND LATCHING,
数据表
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
