描述
The 1-103670-3 is a wire receptacle housing component of the TE Connectivity AMPMODU MTE interconnect system, designed for wire-to-board and wire-to-wire applications. This receptacle housing accommodates 2-25 positions per row and supports both Insulation Displacement Contacts (IDC) and crimp snap-in contact configurations, providing flexibility for various assembly methods. The product operates over a temperature range of -65°C to +105°C and carries a maximum current rating of 3 amps per single contact in free air at 267 V operating voltage. The housing features latching and polarization capabilities with available coupling shrouds for ganging smaller assemblies into larger single or double-row configurations. This component is widely used in medical instruments, automotive controls, computers, commercial printers, appliances, and telecommunications equipment where reliable interconnection is essential.
产品亮点:
- Header
- Number of Positions = 14
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 11036703
规格
常见问题
1-103670-3 是否符合 RoHS 标准?
不,1-103670-3 不符合 RoHS 标准。
1-103670-3 的交货期是多少?
1-103670-3 的标准交货期约为 17 天。有库存的数量由 Master Electronics 发货。
有存货: 594
可立即发货
库存数量的起订量: 70
缺货数量的起订量: 70
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 14
工厂交货期 17 周
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