注册
CN
English
中文 / 汉语
Deutsch
Español
Nederlands
描述
104549-9 is an 80-position fine pitch SMT stacking connector designed for parallel board-to-board applications with 0.050 inch (1.27 mm) center spacing. The connector features a double-row vertical configuration with a housing constructed from glass-filled black thermoplastic rated 54V-0, and phosphor bronze contacts plated with 0.0076 mm gold in the mating area and 0.0038 mm tin-lead on the solder tail, with complete nickel underplating of 0.0127 mm. Key dimensions include an overall length (A) of 2.130 inches (54.10 mm), width (B) of 1.950 inches (49.53 mm), and spacing dimensions (C and D) of 0.900 inches (22.86 mm). This connector is ideal for high-density interconnect applications in computing, telecommunications, and industrial equipment where reliable board-to-board connections are required in space-constrained environments.
产品亮点:
- Header Assembly
- Number of Positions = 80
- Number of Rows = Dual
- Shrouded
- Vertical Mount Angle
搜索关键词: 1045499
规格
常见问题
104549-9 是否符合 RoHS 标准？
不，104549-9 不符合 RoHS 标准。
104549-9 的交货期是多少？
104549-9 的标准交货期约为 19 周。有库存的数量由 Master Electronics 发货。
有存货: 130
发货 today, 输入设置值。
缺货数量的起订量: 81
工厂交货期 19 周
价格 (USD)
3D PDF
产品指南
Product Drawing - HEADER ASSY, VERTICAL, SHROUDED DUAL ROW, W/LATCHES AND HOLD DOWNS
数据表
Product Specification - AMPMODU System 50 SMT (Surface Mount Technology) Receptacles and Headers
