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描述
104549-9 is an 80-position fine pitch SMT stacking connector designed for parallel board-to-board applications with 0.050 inch (1.27 mm) center spacing. The connector features a double-row vertical configuration with a housing constructed from glass-filled black thermoplastic rated 54V-0, and phosphor bronze contacts plated with 0.0076 mm gold in the mating area and 0.0038 mm tin-lead on the solder tail, with complete nickel underplating of 0.0127 mm. Key dimensions include an overall length (A) of 2.130 inches (54.10 mm), width (B) of 1.950 inches (49.53 mm), and spacing dimensions (C and D) of 0.900 inches (22.86 mm). This connector is ideal for high-density interconnect applications in computing, telecommunications, and industrial equipment where reliable board-to-board connections are required in space-constrained environments.
产品亮点:
- Header Assembly
- Number of Positions = 80
- Number of Rows = Dual
- Shrouded
- Vertical Mount Angle
搜索关键词: 1045499
规格
FREQUENTLY ASKED QUESTIONS
Is 104549-9 RoHS compliant?
No, 104549-9 is not RoHS compliant.
What is the lead time for 104549-9?
The standard lead time for 104549-9 is approximately 19 days. In-stock quantities ship from Master Electronics.
有存货: 130
发货 today, 输入设置值。
缺货数量的起订量: 81
工厂交货期 19 周
价格 (USD)
3D PDF
产品指南
Product Drawing - HEADER ASSY, VERTICAL, SHROUDED DUAL ROW, W/LATCHES AND HOLD DOWNS
数据表
Product Specification - AMPMODU System 50 SMT (Surface Mount Technology) Receptacles and Headers
