描述
104074-6 is a 30-position shrouded header designed for board-to-board vertical interconnection within the AMPMODU Interconnection System. It features a 0.050 x 0.100 inch (1.27 x 2.54 mm) centerline spacing and is constructed with a glass-filled thermoplastic housing rated 94V-0 in black. The contacts are made of copper alloy with duplex plating: 0.000030 inch (0.00076 mm) gold in the mating area and 0.000150 inch (0.00381 mm) tin on solder posts, with an entire contact underplated 0.000050 inch (0.00127 mm) nickel. This header is commonly used in PC/104 and embedded computing applications where reliable board-to-board connections and compact spacing are required.
产品亮点:
- Header Assembly
- Number of Positions = 30
- Number of Rows = Single
- Shrouded
- Right Angle Mount Angle
搜索关键词: 1040746
规格
FREQUENTLY ASKED QUESTIONS
Is 104074-6 RoHS compliant?
No, 104074-6 is not RoHS compliant.
What is the lead time for 104074-6?
The standard lead time for 104074-6 is approximately 19 days. In-stock quantities ship from Master Electronics.
有存货: 44
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库存数量的起订量: 11
缺货数量的起订量: 11
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工厂交货期 19 周
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