描述
104074-6 is a 30-position shrouded header designed for board-to-board vertical interconnection within the AMPMODU Interconnection System. It features a 0.050 x 0.100 inch (1.27 x 2.54 mm) centerline spacing and is constructed with a glass-filled thermoplastic housing rated 94V-0 in black. The contacts are made of copper alloy with duplex plating: 0.000030 inch (0.00076 mm) gold in the mating area and 0.000150 inch (0.00381 mm) tin on solder posts, with an entire contact underplated 0.000050 inch (0.00127 mm) nickel. This header is commonly used in PC/104 and embedded computing applications where reliable board-to-board connections and compact spacing are required.
产品亮点:
- Header Assembly
- Number of Positions = 30
- Number of Rows = Single
- Shrouded
- Right Angle Mount Angle
搜索关键词: 1040746
规格
常见问题
104074-6 是否符合 RoHS 标准?
不,104074-6 不符合 RoHS 标准。
104074-6 的交货期是多少?
104074-6 的标准交货期约为 19 周。有库存的数量由 Master Electronics 发货。
有存货: 44
可立即发货
库存数量的起订量: 11
缺货数量的起订量: 11
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 11
工厂交货期 19 周
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