描述
103735-2 is a single-row vertical through-hole (THT) header connector from the AMPMODU MTE interconnect system, featuring 30 µ" gold plating for enhanced durability and conductivity. This connector is designed for wire-to-board applications and supports 2–25 positions per row with a 100 mil centerline spacing. It accommodates wire gauges from #22–#30 AWG for IDC (Insulation Displacement Contact) configurations and operates reliably across a temperature range of -65°C to +105°C. The connector carries a maximum current rating of 3 amps per single contact in free air at 267 V operating voltage, making it suitable for industrial applications including medical instruments, automotive controls, computers, and telecommunications equipment. The swage option on posts provides secure retention in printed circuit boards, and the design supports both latching and polarization features for reliable mating.
产品亮点:
- Header
- Number of Positions = 3
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
- Terminate To Printed Circuit Board
搜索关键词: 1037352
规格
常见问题
103735-2 是否符合 RoHS 标准?
不,103735-2 不符合 RoHS 标准。
103735-2 的交货期是多少?
103735-2 的标准交货期约为 15 天。有库存的数量由 Master Electronics 发货。
有存货: 37
可立即发货
您可以购买所有有库存数量的 37
仅库存批次: 37
库存数量的起订量: 270
缺货数量的起订量: 270
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 54
工厂交货期 15 周
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