描述
The 103673-3 is a right-angle through-hole (THT) header connector with hold-down feature, part of the TE Connectivity AMPMODU MTE interconnect system designed for wire-to-board applications. It features 15 microinches of gold plating and supports 2–25 positions per row with a 100 mil centerline spacing. The connector accommodates wire gauges from #22 to #30 AWG and operates reliably across a temperature range of -65°C to +105°C, with a maximum current rating of 3 amps per single contact in free air at 267 V operating voltage. The hold-down design provides secure retention in printed circuit boards, making it ideal for industrial applications including medical instruments, automotive controls, computers, and telecommunications equipment where reliable wire-to-board connections are essential.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 4
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 1036733
规格
常见问题
103673-3 是否符合 RoHS 标准?
不,103673-3 不符合 RoHS 标准。
103673-3 的交货期是多少?
103673-3 的标准交货期约为 25 周。有库存的数量由 Master Electronics 发货。
有存货: 1,093
可立即发货
最小订购数量: 42
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 42
工厂交货期 25 周
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