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描述
The 103672-2 is a right-angle, through-hole header connector with matte tin plating, designed for wire-to-board interconnection applications within the AMPMODU MTE interconnect system. It features a hold-down design that provides retention in printed circuit boards and supports 2–25 positions per row with a 100 mil centerline spacing. The connector operates over a temperature range of -65°C to +105°C and accommodates wire gauges from #22 to #30 AWG for IDC (Insulation Displacement Contact) configurations, with a maximum current rating of 3 amps per single contact in free air at 267 V operating voltage. This header is commonly used in medical instruments, automotive controls, computers, commercial printers, appliances, and telecommunications equipment where reliable wire-to-board connections are required.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 3
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 1036722
规格
常见问题
103672-2 是否符合 RoHS 标准？
不，103672-2 不符合 RoHS 标准。
103672-2 的交货期是多少？
103672-2 的标准交货期约为 23 周。有库存的数量由 Master Electronics 发货。
有存货: 8,536
可立即发货
最小订购数量: 52
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 52
工厂交货期 23 周
3D PDF
Product Drawing - HDR ASSY, RTANG, SR 2.54[.100] CL, 0.64[.025] SQ POST,
数据表
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
